W29GL032C_13 Datasheet, PDF (4/68 Pages) Winbond – 32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE

W29GL032C
7.6 Common Flash Memory Interface (CFI) Mode ............................................................. 25
7.6.1 Query Instruction and Common Flash memory Interface (CFI) Mode.............................25
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ELECTRICAL CHARACTERISTICS ......................................................................................... 29
8.1 Absolute Maximum Stress Ratings............................................................................... 29
8.2 Operating Temperature and Voltage ............................................................................ 29
8.3 DC Characteristics ........................................................................................................ 30
8.4 Switching Test Circuits.................................................................................................. 31
8.4.1 Switching Test Waveform ............................................................................................... 31
8.5 AC Characteristics ........................................................................................................ 32
8.5.1 Instruction Write Operation ............................................................................................. 33
8.5.2 Read / Reset Operation .................................................................................................. 34
8.5.3 Erase/Program Operation ............................................................................................... 36
8.5.4 Write Operation Status....................................................................................................46
8.5.5 WORD/BYTE CONFIGURATION (#BYTE)..................................................................... 50
8.5.6 DEEP POWER DOWN MODE........................................................................................52
8.5.7 WRITE BUFFER PROGRAM..........................................................................................52
8.6 Recommended Operating Conditions........................................................................... 53
8.6.1 At Device Power-up ........................................................................................................ 53
8.7 Erase and Programming Performance ......................................................................... 54
8.8 Data Retention .............................................................................................................. 54
8.9 Latch-up Characteristics ............................................................................................... 54
8.10 Pin Capacitance............................................................................................................ 54
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PACKAGE DIMENSIONS ......................................................................................................... 55
9.1 TSOP 48-pin 12x20mm ................................................................................................ 55
9.2 TSOP 56-pin 14x20mm ................................................................................................ 56
9.3 Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBGA64) ......................... 57
9.4 Thin & Fine-Pitch Ball Grid Array, 6x8 mm², pitch: 0.8 mm, ∅=0.4mm (TFBGA48) .... 58
10 ORDERING INFORMATION..................................................................................................... 59
10.1 Ordering Part Number Definitions................................................................................. 59
10.2 Valid Part Numbers and Top Side Marking .................................................................. 60
11 HISTORY .................................................................................................................................. 61
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