W25P16VSFIG-TR Datasheet, PDF (39/43 Pages) Winbond – 8M-BIT, 16M-BIT AND 32M-BIT SERIAL FLASH MEMORY

W25P80 / W25P16 / W25P32
11. PACKAGE SPECIFICATION
11.1 8-Pin SOIC 208-mil (Winbond Package Code SS)
SYMBOL
MILLIMETERS
MIN
MAX
INCHES
MIN
MAX
A
1.75
2.16
0.069 0.085
A1
0.05
0.25
0.002 0.010
A2
1.70
1.91
0.067 0.075
b
0.35
0.48
0.014 0.019
C
0.19
0.25
0.007 0.010
D
5.18
5.38
0.204 0.212
E
7.70
8.10
0.303 0.319
E1
5.18
5.38
0.204 0.212
e
1.27 BSC
0.050 BSC
L
0.50
0.80
0.020 0.031
θ
0^o
8^o
0^o
8^o
y
---
0.10
---
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
Publication Release Date: December 11, 2005
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Revision J