English
Language : 

W25P16VSFIG-TR Datasheet, PDF (3/43 Pages) Winbond – 8M-BIT, 16M-BIT AND 32M-BIT SERIAL FLASH MEMORY
W25P80 / W25P16 / W25P32
9.2.8 Fast Read (0Bh) .............................................................................................................19
9.2.9 Page Program (02h) .......................................................................................................20
9.2.10 Sector Erase (D8h).......................................................................................................21
9.2.11 Chip Erase (C7h)..........................................................................................................22
9.2.12 Power-down (B9h) ........................................................................................................23
9.2.13 Release Power-down / Device ID (ABh) .......................................................................23
9.2.14 Read Manufacturer / Device ID (90h) ...........................................................................25
9.2.15 JEDEC ID (9Fh)............................................................................................................26
9.2.16 Read Parameter Page (53h).........................................................................................27
9.2.17 Fast Read Parameter Page (5Bh) ................................................................................28
9.2.18 Program Parameter Page (52h) ...................................................................................29
9.2.19 Erase Parameter Page (D5h) .......................................................................................31
10. ELECTRICAL CHARACTERISTICS......................................................................................... 32
10.1 Absolute Maximum Ratings (1) .................................................................................... 32
10.2 Operating Ranges......................................................................................................... 32
10.3 Power-up Timing and Write Inhibit Threshold .............................................................. 33
10.4 DC Electrical Characteristics (Preliminary)(1) .............................................................. 34
10.5 AC Measurement Conditions........................................................................................ 35
10.6 AC Electrical Characteristics ........................................................................................ 36
10.7 Serial Output Timing ..................................................................................................... 38
10.8 Input Timing .................................................................................................................. 38
10.9 Hold Timing................................................................................................................... 38
11. PACKAGE SPECIFICATION .................................................................................................... 39
11.1 8-Pin SOIC 208-mil (Winbond Package Code SS) (NexFlash Package Code S)........ 39
11.2 16-Pin SOIC 300-mil (Winbond Package Code SF)(NexFlash Package Code F)....... 40
12. ORDERING INFORMATION .................................................................................................... 41
13. REVISION HISTORY ................................................................................................................ 42
Publication Release Date: December 11, 2005
-3-
Revision J