W25P10 Datasheet, PDF (34/35 Pages) Winbond – 1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI

W25P10, W25P20 AND W25P40
11. REVISION HISTORY
VERSION
A
DATE
04/29/03
B
09/12/03
C
03/09/04
D
03/24/04
E
05/11/04
F
06/16/04
G
11/23/04
H
12/08/04
I
04/04/05
J
05/09/05
K
06/14/05
L
06/28/05
M
11/28/05
PAGE
10, 11, 14, 16,
24
ALL
DESCRIPTION
New Create
Incorporated spiFlash trademark for
W25P10, 20 and 40 product family. Adjusted
data for consistency
Adjusted pages for technical clarity. Updated
Special Options and Ordering Information
MLP metal die pad notification; Under
"Package Types," figure 3 and packaging
information.
Corrected dimensions in Packaging
Information section for 6x5mm MLP. Updated
Characterization information DC & AC
Modified dimensional data in the Packaging
Information for the 6x5mm MLP package
Added FR = 40MHz @ 3.0V to 3.6V VCC.
Added fR = 33MHz @ 3.0V to 3.6V VCC.
Modified tLEAD in Absolute Maximum Ratings
to reference JEDEC Standard information.
Added FR and fR conditions to Operating
Ranges. Updated ICC3 and ICC5 data in DC
Electrical Characteristics. Added 20/33MHz
call outs and updated min, max and typ data
in AC Electrical Characteristics
Updated 8-pin 150-mil SOIC package
information.
Removed 8-contact 6x5 MLP package from
document.
Updated and improved AC Parameters in
Table 7.6 and changed tCHSH, tCLQV and
tHLCH to reference voltage (2.7V-3.6V / 3.0V-
3.6V) for consistency with other spiFlash
memory data sheets.
Updated Important Notice.
Changed NexFlash part numbers to Winbond
part numbers and updated ordering and
contact information
Updated data sheet to comply with Winbond
standard
Updated FR and fR values in Operating
Ranges Table and AC Characteristics Table.
Updated Read Data (fR) values in Operating
Range and AC Characteristics Tables from
33MHz to 25MHz.
Corrected the pin assignment on table of pin
description of page 5.
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