W25P10 Datasheet, PDF (32/35 Pages) Winbond – 1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI

W25P10, W25P20 AND W25P40
9. PACKAGE SPECIFICATION
9.1 8-Pin SOIC 150-mil (Winbond Package Code SN)
SYMBOL
A
A1
A2
b
C
D⁽³⁾
E
E1⁽³⁾
e⁽²⁾
L
θ
CP
MILLIMETERS
MIN
TYP.
MAX
1.47
1.60
1.72
0.10
---
0.24
---
1.45
---
0.33
0.41
0.50
0.19
0.20
0.25
4.80
4.85
4.95
5.80
6.00
6.19
3.80
3.90
4.00
1.27 BSC
0.40
0.71
1.27
0^o
---
8^o
---
---
0.10
INCHES
MIN
0.058
0.004
---
0.013
0.0075
0.189
0.228
0.150
0.015
0^o
---
TYP.
0.063
---
0.057
0.016
0.008
0.191
0.236
0.154
0.050 BSC
0.028
---
---
MAX
0.068
0.009
---
0.020
0.0098
0.195
0.244
0.157
0.050
8^o
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
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