W25P10 Datasheet, PDF (3/35 Pages) Winbond – 1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI

W25P10, W25P20 AND W25P40
7.2.11
7.2.12
7.2.13
7.2.14
Chip Erase (C7h)..........................................................................................................20
Power-down (B9h) ........................................................................................................21
Release Power-down / Device ID (ABh) .......................................................................22
Read Manufacturer / Device ID (90h) ...........................................................................24
8. ELECTRICAL CHARACTERISTICS......................................................................................... 25
8.1 Absolute Maximum Ratings ⁽¹⁾ .................................................................................... 25
8.2 Operating Ranges......................................................................................................... 25
8.3 Power-up Timing and Write Inhibit Threshold .............................................................. 26
8.4 DC Electrical Characteristics (Preliminary)(1) .............................................................. 27
8.5 AC Measurement Conditions........................................................................................ 28
8.6 AC Electrical Characteristics ........................................................................................ 29
8.7 AC Electrical Characteristics (cont’d) ........................................................................... 30
8.8 Serial Output Timing ..................................................................................................... 31
8.9 Input Timing .................................................................................................................. 31
8.10 Hold Timing................................................................................................................... 31
9. PACKAGE SPECIFICATION .................................................................................................... 32
9.1 8-Pin SOIC 150-mil (Winbond Package Code SN) (NexFlash Package Code N) ....... 32
10. ORDERING INFORMATION .................................................................................................... 33
11. REVISION HISTORY ................................................................................................................ 34
Publication Release Date: November 28, 2005
-3-
Revision M