W25X64V Datasheet, PDF (33/44 Pages) Winbond – 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X64
11.4 DC Electrical Characteristics
PARAMETER
SYMBOL CONDITIONS
SPEC
UNIT
MIN
TYP
MAX
Input Capacitance
CIN⁽¹⁾
VIN = 0V⁽²⁾
6
pF
Output Capacitance Cout⁽¹⁾
VOUT = 0V⁽²⁾
8
pF
Input Leakage
ILI
±2
µA
I/O Leakage
ILO
±2
µA
Standby Current
ICC1
/CS = VCC,
VIN = GND or VCC
25
50
µA
Power-down Current ICC2
/CS = VCC,
VIN = GND or VCC
<1
10
µA
Current Read Data /
Dual Output Read
ICC3
1MHz⁽²⁾
C = 0.1 VCC / 0.9 VCC
DO = Open
5/6
7/8
mA
Current Read Data /
Dual Output Read
ICC3
33MHz⁽²⁾
C = 0.1 VCC / 0.9 VCC
DO = Open
7/8
11/12
mA
Current Read Data /
Dual Output Read
ICC3
50MHz⁽²⁾
C = 0.1 VCC / 0.9 VCC
DO = Open
9/10
13/15
mA
Current Read Data /
Dual Output Read
ICC3
75MHz⁽²⁾
C = 0.1 VCC / 0.9 VCC
DO = Open
11/12 16/18
mA
Current Page
Program
ICC4
/CS = VCC
20
25
mA
Current Write Status
Register
ICC5
/CS = VCC
10
18
mA
Current Sector/Block
Erase
ICC6
/CS = VCC
20
25
mA
Current Chip Erase ICC7
/CS = VCC
20
25
mA
Input Low Voltage
VIL
–0.5
VCC x 0.3 V
Input High Voltage VIH
VCC x0.7
VCC +0.4 V
Output Low Voltage VOL
IOL = 1.6 mA
0.4
V
Output High Voltage VOH
IOH = –100 µA
VCC –0.2
V
Note s :
1. Tested on sample basis and specified through design and characterization data. TA=25° C, VCC 3V.
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Publication Release Date: December 19, 2008
Revision A