W25X64V Datasheet, PDF (3/44 Pages) Winbond – 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X64
10.2.3 Write Enable (06h)....................................................................................................................16
10.2.4 Write Disable (04h) ..................................................................................................................16
10.2.5 Read Status Register (05h)....................................................................................................17
10.2.6 Write Status Register (01h) ....................................................................................................18
10.2.7 Read Data (03h) .......................................................................................................................19
10.2.8 Fast Read (0Bh)........................................................................................................................20
10.2.9 Fast Read Dual Output (3Bh).................................................................................................21
10.2.10 Page Program (02h)..............................................................................................................22
10.2.11 Sector Erase (20h).................................................................................................................23
10.2.12 Block Erase (D8h)..................................................................................................................24
10.2.13 Chip Erase (C7h) ...................................................................................................................25
10.2.14 Power-down (B9h) .................................................................................................................26
10.2.15 Release Power-down / Device ID (ABh) ............................................................................27
10.2.16 Read Manufacturer / Device ID (90h)..................................................................................29
10.2.17 JEDEC ID (9Fh) ......................................................................................................................30
11 ELECTRICAL CHARACTERISTICS......................................................................................31
11.1 Absolute Maximum Ratings ....................................................................................31
11.2 Operating Ranges ..................................................................................................31
11.3 Power-up Timing and Write Inhibit Threshold.............................................................32
11.4 DC Electrical Characteristics...................................................................................33
11.5 AC Measurement Conditions ...................................................................................35
11.6 AC Electrical Characteristics...................................................................................36
11.7 AC Electrical Characteristics (cont’d).......................................................................37
11.8 Serial Output Timing...............................................................................................38
11.9 Input Timing...........................................................................................................38
11.10 Hold Timing ..........................................................................................................38
12 PACKAGE SPECIFICATION...............................................................................................39
12.1 8-Pin PDIP 300-mil (Package Code DA) ...................................................................39
12.2 8-Contact 8x6mm WSON (Package Code ZE) ..........................................................40
12.3 16-Pin SOIC 300-mil (Winbond Package Code SF)....................................................41
13 ORDERING INFORMATION ⁽¹⁾ ............................................................................................42
14 REVISION HISTORY..........................................................................................................44
Publication Release Date: December 19, 2008
-3-
Revision A