W25X64V Datasheet, PDF (2/44 Pages) Winbond – 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X64
Table of Contents
1
GENERAL DESCRIPTION................................................................................................... 4
2
FEATURES........................................................................................................................ 4
3
PIN CONFIGURATION WSON 8X6-MM ................................................................................ 5
4
PIN CONFIGURATION PDIP 300-MIL ................................................................................... 5
5
PIN DESCRIPTION PDIP 300-MIL, WSON 8X6...................................................................... 6
6
PIN CONFIGURATION SOIC 300-MIL ................................................................................... 6
7
PIN DESCRIPTION SOIC 300-MIL........................................................................................ 7
7.1 Package Types ....................................................................................................... 8
7.2 Chip Select (/CS) .................................................................................................... 8
7.3 Serial Data Output (DO)........................................................................................... 8
7.4 Write Protect (/WP)................................................................................................. 8
7.5 HOLD (/HOLD)........................................................................................................ 8
7.6 Serial Clock (CLK)................................................................................................... 8
7.7 Serial Data Input / Output (DIO) ................................................................................ 8
8
BLOCK DIAGRAM.............................................................................................................. 9
9
FUNCTIONAL DESCRIPTION .............................................................................................10
9.1 SPI OPERATIONS .................................................................................................10
9.1.1 SPI Modes ....................................................................................................................................10
9.1.2 Dual Output SPI...........................................................................................................................10
9.1.3 Hold Function ..............................................................................................................................10
9.2 WRITE PROTECTION.............................................................................................11
9.2.1 Write Protect Features ...............................................................................................................11
10 CONTROL AND STATUS REGISTERS ................................................................................12
10.1
STATUS REGISTER...............................................................................................12
10.1.1 BUSY...........................................................................................................................................12
10.1.2 Write Enable Latch (WEL).......................................................................................................12
10.1.3 Block Protect Bits (BP2, BP1, BP0) .......................................................................................12
10.1.4 Top/Bottom Block Protect (TB) ...............................................................................................12
10.1.5 Reserved Bits ............................................................................................................................12
10.1.6 Status Register Protect (SRP)................................................................................................13
10.1.7 Status Regis ter Mem ory Protection.......................................................................................13
10.2
INSTRUCTIONS .....................................................................................................14
10.2.1 Manufacturer and Device Identification.................................................................................14
10.2.2 Instruction Set............................................................................................................................15
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