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W83791SD Datasheet, PDF (3/22 Pages) Winbond – H/W MONITORING IC
W83791SD/W83791SG
Table of Contents-
1. GENERAL DESCRIPTION ......................................................................................................... 1
2. FEATURES ................................................................................................................................. 1
3. KEY SPECIFICATIONS .............................................................................................................. 2
4. PIN CONFIGURATION ............................................................................................................... 2
5. PIN DESCRIPTION..................................................................................................................... 3
6. FUNCTION DESCRIPTION ........................................................................................................ 4
6.1 Speech Function ............................................................................................................. 4
6.1.1 General Description..........................................................................................................4
6.1.2 Event Trigger Queue ........................................................................................................4
6.1.3 Connection of EEPROM...................................................................................................5
6.1.4 Speaker Output ................................................................................................................6
7. CONTROL AND STATUS REGISTER ....................................................................................... 6
7.1 Speech Flash Memory Address Registers  Index 00h-02h (Bank 0).......................... 6
7.2 Speech Flash Memory Data Registers  Index 03h-06h (Bank 0) ............................... 6
7.3 Event Trigger Timeout Register  Index 08h (Bank 0).................................................. 7
7.4 Speech Programmable Trigger Register  Index 09h (Bank 0).................................... 8
7.5 Speech Input Trigger Property Register  Index 0Ah (Bank 0) .................................... 8
7.6 Speech Flash Memory Read Data Registers  Index 0Dh-0Eh (Bank 0)..................... 8
7.7 User Defined Registers  Index 18h-1Ch (Bank 0)....................................................... 9
7.8 Speech Control Register 1  Index 1Fh (Bank 0) ......................................................... 9
7.9 Serial Bus Address Register  Index 48h (Bank 0)....................................................... 9
7.10 Device ID  Index 49h (Bank 0) .................................................................................... 9
7.11 Disable Abnormal BEEP Control Register  Index 4Dh (Bank 0)............................... 10
7.12 High Byte Access  Index 4Eh (Bank 0) ..................................................................... 10
7.13 Winbond Vendor ID  Index 4Fh (Bank 0) .................................................................. 10
7.14 Winbond Test Register  Index 50h - 55h (Bank 0).................................................... 10
7.15 Chip ID -- Index 58h (Bank 0) ....................................................................................... 10
7.16 Speech Flash Memory Read Data Registers  Index A4h-A5h (Bank 0) ................... 11
7.17 Flash Page count  Index A7h (Bank 0) ..................................................................... 11
8. ELECTRICAL CHARACTERISTICS......................................................................................... 11
8.1 Absolute Maximum Ratings .......................................................................................... 11
8.2 DC Characteristics ........................................................................................................ 11
8.3 AC Characteristics ........................................................................................................ 13
8.3.1 Serial Bus Timing Diagram.............................................................................................13
9. HOW TO READ THE TOP MARKING...................................................................................... 14
10. PACKAGE SPECIFICATION .................................................................................................... 15
11. APPLICATION CIRCUITS ........................................................................................................ 16
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Publication Release Date: January 18, 2005
Revision 1.1