W83791SD Datasheet, PDF (18/22 Pages) Winbond – H/W MONITORING IC

W83791SD/W83791SG
10. PACKAGE SPECIFICATION
48-pin LQFP
HD
D
36
25
37
24
E HE
48
13
1
e
b ¹²
Seating Plane
See Detail F
A2 A
A1
y
c
L
L1
Detail F
Symbol
A
A1
A2
b
c
D
E
e
HD
HE
L
L1
y
0
Dimension in inch
Min. Nom. Max.
Dimension in mm
Min. Nom. Max.
---
0.05
1.35
0.17
0.09
---
---
1.40
0.20
---
1.60
0.15
1.45
0.27
0.20
7.00
7.00
0.50
9.00
9.00
0.45 0.60 0.75
1.00
--- 0.08
---
0
3.5
7
Notes:
1. Dimensions D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
on final visual inspection spec.
- 15 -
Publication Release Date: January 18, 2005
Revision 1.1