W25X64BV Datasheet, PDF (3/43 Pages) Winbond – 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X64BV
10.2.6 Write Status Register (01h) ..........................................................................................17
10.2.7 Read Data (03h) ...........................................................................................................18
10.2.8 Fast Read (0Bh) ...........................................................................................................19
10.2.9 Fast Read Dual Output (3Bh) .......................................................................................20
10.2.10 Page Program (02h) ...................................................................................................21
10.2.11 Sector Erase (20h) .....................................................................................................22
10.2.12 32KB Block Erase (52h) .............................................................................................23
10.2.13 Block Erase (D8h) ......................................................................................................24
10.2.14 Chip Erase (C7h or 60h).............................................................................................25
10.2.15 Power-down (B9h) ......................................................................................................26
10.2.16 Release Power-down / Device ID (ABh) .....................................................................27
10.2.17 Read Manufacturer / Device ID (90h) .........................................................................29
10.2.18 JEDEC ID (9Fh) .........................................................................................................30
11. ELECTRICAL CHARACTERISTICS......................................................................................... 31
11.1 Absolute Maximum Ratings .......................................................................................... 31
11.2 Operating Ranges......................................................................................................... 31
11.3 Power-up Timing and Write Inhibit Threshold .............................................................. 32
11.4 DC Electrical Characteristics ........................................................................................ 33
11.5 AC Measurement Conditions........................................................................................ 34
11.6 AC Electrical Characteristics ........................................................................................ 35
11.7 AC Electrical Characteristics (cont’d) ........................................................................... 36
11.8 Serial Output Timing ..................................................................................................... 37
11.9 Input Timing .................................................................................................................. 37
11.10 Hold Timing ................................................................................................................. 37
12. PACKAGE SPECIFICATION .................................................................................................... 38
12.1 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 38
12.2 8-Contact 8x6mm WSON (Package Code ZE) ............................................................ 39
12.3 16-Pin SOIC 300-mil (Package Code SF) .................................................................... 40
13. ORDERING INFORMATION .................................................................................................... 41
13.1 Valid Part Numbers and Top Side Marking .................................................................. 42
14. REVISION HISTORY ................................................................................................................ 43
Publication Release Date: August 7, 2009
-3-
Preliminary -- Revision B