W25X64BV Datasheet, PDF (2/43 Pages) Winbond – 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X64BV
Table of Contents
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
4.
PAD CONFIGURATION WSON 8X6-MM .................................................................................. 5
5.
PIN DESCRIPTION SOIC 208-MIL, WSON 8X6-MM ................................................................ 5
6.
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 6
7.
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 6
7.1 Package Types ............................................................................................................... 7
7.2 Chip Select (/CS) ............................................................................................................ 7
7.3 Serial Data Output (DO) ................................................................................................. 7
7.4 Write Protect (/WP)......................................................................................................... 7
7.5 HOLD (/HOLD) ............................................................................................................... 7
7.6 Serial Clock (CLK) .......................................................................................................... 7
7.7 Serial Data Input / Output (DIO) ..................................................................................... 7
8.
BLOCK DIAGRAM ...................................................................................................................... 8
9.
FUNCTIONAL DESCRIPTION ................................................................................................... 9
9.1 SPI OPERATIONS ......................................................................................................... 9
9.1.1 SPI Modes........................................................................................................................9
9.1.2 Dual Output SPI ...............................................................................................................9
9.1.3 Hold Function ...................................................................................................................9
9.2 WRITE PROTECTION.................................................................................................. 10
9.2.1 Write Protect Features....................................................................................................10
10. CONTROL AND STATUS REGISTERS................................................................................... 11
10.1 STATUS REGISTER .................................................................................................... 11
10.1.1 BUSY............................................................................................................................11
10.1.2 Write Enable Latch (WEL) ............................................................................................11
10.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................11
10.1.4 Top/Bottom Block Protect (TB).....................................................................................11
10.1.5 Reserved Bits ...............................................................................................................11
10.1.6 Status Register Protect (SRP)......................................................................................12
10.1.7 Status Register Memory Protection ..............................................................................12
10.2 INSTRUCTIONS........................................................................................................... 13
10.2.1 Manufacturer and Device Identification ........................................................................13
10.2.2 Instruction Set ..............................................................................................................14
10.2.3 Write Enable (06h)........................................................................................................15
10.2.4 Write Disable (04h).......................................................................................................15
10.2.5 Read Status Register (05h) ..........................................................................................16
-2-