W25X40BL Datasheet, PDF (3/55 Pages) Winbond – 2.5V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

W25X40BL
7.2.8 Read Data (03h) .............................................................................................................19
7.2.9 Fast Read (0Bh) .............................................................................................................20
7.2.10 Fast Read Dual Output (3Bh) .......................................................................................21
7.2.11 Fast Read Dual I/O (BBh).............................................................................................22
7.2.12 Continuous Read Mode Bits (M7-0) .............................................................................24
7.2.13 Continuous Read Mode Reset (FFFFh) .......................................................................24
7.2.14 Page Program (02h) .....................................................................................................25
7.2.15 4KB Sector Erase (20h)................................................................................................26
7.2.16 32KB Block Erase (52h) ...............................................................................................27
7.2.17 64KB Block Erase (D8h)...............................................................................................28
7.2.18 Chip Erase (C7h or 60h)...............................................................................................29
7.2.19 Power-down (B9h) ........................................................................................................30
7.2.20 Release Power-down / Device ID (ABh) .......................................................................31
7.2.21 Read Manufacturer / Device ID (90h) ...........................................................................33
7.2.22 Read Manufacturer / Device ID Dual I/O (92h) .............................................................34
7.2.23 Read Unique ID Number (4Bh).....................................................................................35
7.2.24 JEDEC ID (9Fh)............................................................................................................36
8. ELECTRICAL CHARACTERISTICS ......................................................................................... 37
8.1 Absolute Maximum Ratings .......................................................................................... 37
8.2 Operating Ranges ......................................................................................................... 37
8.3 Power-up Timing and Write Inhibit Threshold............................................................... 38
8.4 DC Electrical Characteristics ........................................................................................ 39
8.5 AC Measurement Conditions ........................................................................................ 40
8.6 AC Electrical Characteristics (2.3~3.6V)....................................................................... 41
8.7 AC Electrical Characteristics (2.7~3.6V)....................................................................... 43
8.8 Serial Output Timing ..................................................................................................... 45
8.9 Serial Input Timing ........................................................................................................ 45
8.10 Hold Timing................................................................................................................... 45
8.11 Write Protect Timing ..................................................................................................... 45
9. PACKAGE SPECIFICATION .................................................................................................... 46
9.1 8-Pin SOIC 150-mil (Package Code SN) ...................................................................... 46
9.2 8-Pin VSOP 150-mil (Package Code SV) ..................................................................... 47
9.3 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 48
9.4 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 49
9.5 8-Pad USON 2x3-mm (Package Code UX).................................................................. 50
9.6 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 51
10. ORDERING INFORMATION..................................................................................................... 53
10.1 Valid Part Numbers and Top Side Marking .................................................................. 54
11. REVISION HISTORY ................................................................................................................ 55
Publication Release Date: April 21, 2011
-3-
Preliminary - Revision B