W25X10L Datasheet, PDF (3/46 Pages) Winbond – 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X10L, W25X20L, W25X40L, W25X80L
9.2.6 Write Status Register (01h) ............................................................................................18
9.2.7 Read Data (03h) .............................................................................................................19
9.2.8 Fast Read (0Bh) .............................................................................................................20
9.2.9 Fast Read Dual Output (3Bh) .........................................................................................21
9.2.10 Page Program (02h) .....................................................................................................22
9.2.11 Sector Erase (20h) .......................................................................................................23
9.2.12 Block Erase (D8h) ........................................................................................................24
9.2.13 Chip Erase (C7h)..........................................................................................................25
9.2.14 Power-down (B9h) ........................................................................................................26
9.2.15 Release Power-down / Device ID (ABh) .......................................................................27
9.2.16 Read Manufacturer / Device ID (90h) ...........................................................................29
9.2.17 JEDEC ID (9Fh)............................................................................................................30
10. ELECTRICAL CHARACTERISTICS......................................................................................... 31
10.1 Absolute Maximum Ratings .......................................................................................... 31
10.2 Operating Ranges......................................................................................................... 31
10.3 Endurance and Data Retention .................................................................................... 31
10.4 Power-up Timing and Write Inhibit Threshold .............................................................. 32
10.5 DC Electrical Characteristics ........................................................................................ 33
10.6 AC Measurement Conditions........................................................................................ 34
10.7 AC Electrical Characteristics ........................................................................................ 35
10.8 AC Electrical Characteristics (cont’d) ........................................................................... 36
10.9 Serial Output Timing ..................................................................................................... 37
10.10 Input Timing................................................................................................................. 37
10.11 Hold Timing ................................................................................................................. 37
11. PACKAGE SPECIFICATION .................................................................................................... 38
11.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38
11.2 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39
11.3 8-contact 6x5 WSON (Package Code ZP) ................................................................... 40
11.4 8-contact 6x5 WSON Cont’d. (Package Code ZP)....................................................... 41
12. ORDERING INFORMATION .................................................................................................... 42
13. W25X10/20/40/80V AND W25X10/20/40/80L SPEC. COMPARISON..................................... 44
14. REVISION HISTORY ................................................................................................................ 45
Publication Release Date: February 27, 2008
-3-
Revision I