W25X10L Datasheet, PDF (2/46 Pages) Winbond – 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X10L, W25X20L, W25X40L, W25X80L
Table of Contents
1. GENERAL DESCRIPTION ......................................................................................................... 4
2. FEATURES ................................................................................................................................. 4
3. PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5
4.
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
5.
PIN CONFIGURATION WSON 6X5-MM .................................................................................... 5
6. PIN DESCRIPTION..................................................................................................................... 6
6.1 Package Types ............................................................................................................... 7
6.2 Chip Select (/CS) ............................................................................................................ 7
6.3 Serial Data Output (DO) ................................................................................................. 7
6.4 Write Protect (/WP)......................................................................................................... 7
6.5 HOLD (/HOLD) ............................................................................................................... 7
6.6 Serial Clock (CLK) .......................................................................................................... 7
6.7 Serial Data Input / Output (DIO) ..................................................................................... 7
7. BLOCK DIAGRAM ...................................................................................................................... 8
8. FUNCTIONAL DESCRIPTION ................................................................................................... 9
8.1 SPI OPERATIONS ......................................................................................................... 9
8.1.1 SPI Modes ........................................................................................................................9
8.1.2 Dual Output SPI................................................................................................................9
8.1.3 Hold Function ...................................................................................................................9
8.2 WRITE PROTECTION.................................................................................................. 10
8.2.1 Write Protect Features....................................................................................................10
9. CONTROL AND STATUS REGISTERS................................................................................... 11
9.1 STATUS REGISTER .................................................................................................... 11
9.1.1 BUSY..............................................................................................................................11
9.1.2 Write Enable Latch (WEL) ..............................................................................................11
9.1.3 Block Protect Bits (BP2, BP1, BP0)................................................................................11
9.1.4 Top/Bottom Block Protect (TB).......................................................................................11
9.1.5 Reserved Bits .................................................................................................................11
9.1.6 Status Register Protect (SRP) ........................................................................................12
9.1.7 Status Register Memory Protection ................................................................................13
9.2 INSTRUCTIONS........................................................................................................... 14
9.2.1 Manufacturer and Device Identification...........................................................................14
9.2.2 Instruction Set.................................................................................................................15
9.2.3 Write Enable (06h)..........................................................................................................16
9.2.4 Write Disable (04h).........................................................................................................16
9.2.5 Read Status Register (05h) ............................................................................................17
Publication Release Date: February 27, 2008
-2-
Revision I