W19B320BT Datasheet, PDF (3/56 Pages) Winbond – 2.7~3.6-volt write (program and erase) operations

W19B320BT/B DATASHEET
9.2 Reset Waveform ................................................................................................................... 45
9.3 #BYTE Waveform for Read Operation.................................................................................. 46
9.4 #BYTE Waveform for Write Operation.................................................................................. 46
9.5 Programming Waveform ....................................................................................................... 47
9.6 Accelerated Programming Waveform ................................................................................... 47
9.7 Chip/Sector Erase Waveform ............................................................................................... 48
9.8 Back-to back Read/Write Cycle Waveform........................................................................... 48
9.9 #Data Polling Waveform (During Embedded Algorithms) .................................................... 49
9.10 Toggle Bit Waveform (During Embedded Algorithms).......................................................... 49
9.11 DQ 2 vs. DQ6 Waveform ...................................................................................................... 50
9.12 Temporary Sector Unprotect Timing Diagram ...................................................................... 50
9.13 Sector/Sector Block Protect and Unprotect Timing Diagram................................................ 50
9.14 Alternate #CE Controlled Write (Erase/Program) Operation Timing .................................... 51
10. LATCHUP CHARACTERISTICS ................................................................................................... 52
11. CAPACITANCE.............................................................................................................................. 52
12. ORDERING INFORMATION.......................................................................................................... 53
13. PACKAGE DIMENSIONS .............................................................................................................. 54
13.1 TFBGA48ball (6X8 mm^2, Ø=0.40mm) ................................................................................ 54
13.2 48-Pin Standard Thin Small Outline Package ...................................................................... 55
14. VERSION HISTORY ...................................................................................................................... 56
Publication Release Date:Dec. 25, 2007
-3-
Revisionv A3