W29C040 Datasheet, PDF (20/20 Pages) Winbond – 512K X 8 CMOS FLASH MEMORY

W29C040
VERSION HISTORY
VERSION
A1
A2
DATE
Apr. 1997
Nov. 1997
A3
June 1998
A4
Oct. 1998
A5
May 1999
PAGE
-
4, 8
9
15
1, 18
6
7
8
4
11
20
9
1, 12, 18
1, 2, 18, 19
DESCRIPTION
Initial Issued
Correct the address from 3FFF2 to 7FFF2
Correct the boot block from 8K to 16K
Modify page write cycle timing diagram waveform
Delete cycling 100K item
Add. pause 10 mS
Add. pause 50 mS
Correct the time from 10 mS to 10 µS
Correct power-on delay from 5 mS to 10 mS
Correct TPU.WRITE (Typ.) from 5 mS to 10 mS
Correct 40-pin TSOP package drawing by 32-pin TSOP
Correct the address from 3FFFF to 7FFFF
Modify TACC:
90/120/150 nS à 90/120 nS binning
Modify package:
PDIP/SOP/PLCC/TSOP à PLCC/TSOP
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]
Note: All data and specifications are subject to change without notice.
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