W29C040 Datasheet, PDF (19/20 Pages) Winbond – 512K X 8 CMOS FLASH MEMORY

PACKAGE DIMENSIONS
32-pin PLCC
4
5
HE
E
1 32
30
29
D HD
13
14
20
L
θ
Seating Plane
e
b
b1
GE
21
A2
A
A1
y
40-pin TSOP
HD
D
1
M^e
0.10 (0.004)
b
θ
L
L1
W29C040
GD
c
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
θ
Dimension in Inches
Min. Nom. Max.
0.140
0.020
0.105 0.110 0.115
0.026 0.028 0.032
0.016 0.018 0.022
0.008 0.010 0.014
0.547 0.550 0.553
0.447 0.450 0.453
0.044 0.050 0.056
0.490 0.510 0.530
0.390 0.410 0.430
0.585 0.590 0.595
0.485 0.490 0.495
0.075 0.090 0.095
0.004
0°
10°
Dimension in mm
Min. Nom. Max.
3.56
0.50
2.67
2.80
2.93
0.66
0.71
0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89 13.97 14.05
11.35 11.43 11.51
1.12
1.27
1.42
12.45 12.95 13.46
9.91 10.41 10.92
14.86 14.99 15.11
12.32 12.45 12.57
1.91
2.29
2.41
0.10
0°
10°
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b1 does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on final
visual inspection sepc.
c
E
A
A2
A1
Y
Dimension in Inches
Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
0.047
1.20
A 1 0.002
0.006 0.05
0.15
A 2 0.037 0.039 0.041 0.95 1.00 1.05
b 0.007 0.009 0.011 0.17 0.22 0.27
c _{0.004 0.006 0.008 0.10 0.15 0.20}
D 0.72 0.724 0.728 18.3 18.4 18.5
E 0.390 0.394 0.398 9.90 10 10.10
H D 0.780 0.787 0.795 19.8 20.0 20.2
e
0.020
0.50
L 0.020 0.024 0.028 0.50 0.60 0.70
L1
0.031
0.8
Y 0.000
0.004 0.00
0.10
θ
0
35
0
3
5
Controlling dimension: Millimeters
- 19 -
Publication Release Date: May 1999
Revision A5