W29EE011 Datasheet, PDF (18/20 Pages) Winbond – 128K X 8 CMOS FLASH MEMORY

W29EE011
PACKAGE DIMENSIONS
32-pin P-DIP
32
E1
1
S
A A²
L
D
B
e1
B1
17
16
E
A1 _{Base Plane}
Seating Plane
a
eA
Dimension in inches Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
0.210
5.33
A 1 0.010
0.25
A 2 0.150 ^{0.155 0.160} 3.81 3.94 4.06
B
0.016 0.018 0.022 0.41 0.46 0.56
B 1 0.048 0.050 0.054 1.22 1.27 1.37
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.650 1.660
41.91 42.16
E
0.590 0.600 0.610 14.99 15.24 15.49
E1
0.545 0.550 0.555 13.84 13.97 14.10
e1
0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.02
S
0.085
2.16
Notes:
1.Dimensions D Max. & S include mold flash or
c
tie bar burrs.
2.Dimension E1 does not include interlead flash.
3.Dimensions D & E1. include mold mismatch and
are determined at the mold parting line.
4.Dimension B1 does not include dambar
protrusion/intrusion.
5.Controlling dimension: Inches
6.General appearance spec. should be based on
final visual inspection spec.
32-pin PLCC
4
5
HE
E
1 32
30
29
D HD
13
14
21
20
L
θ
Seating Plane
e
b
b1
GE
A2 A
A1
y
GD
c
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
θ
Dimension in Inches
Dimension in mm
Min. Nom. Max. Min. Nom. Max.
0.140
3.56
0.020
0.50
0.105 0.110 0.115 2.67
2.80 2.93
0.026 0.028 0.032 0.66
0.71
0.81
0.016 0.018 0.022 0.41
0.46 0.56
0.008 0.010 0.014 0.20
0.25 0.35
0.547 0.550 0.553 13.89 13.97 14.05
0.447 0.450 0.453 11.35 11.43 11.51
0.044 0.050 0.056 1.12
1.27
1.42
0.490
0.390
0.51
0
0.410
0.530
0.430
12.45
9.91
12.9
5
10.41
13.46
10.92
0.585 0.590 0.595 14.86 14.99 15.11
0.485
0.075
0.49
0
0.090
0.495
0.095
12.32
1.91
12.45
2.29
12.57
2.41
0.004
0.10
0°
10°
0°
10°
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b1 does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches
4. General appearance spec. should be based on final
visual inspection sepc.
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