W25P022A Datasheet, PDF (16/17 Pages) Winbond – 64K X 32 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM

PACKAGE DIMENSIONS
100-pin QFP
HD
D
E HE
e
b
See Detail F
Seating Plane
100-pin TQFP
HD
D
A2
A1
y
C
L
L1
E HE
e
b
See Detail F
Seating Plane
A2
A1
y
C
L
L1
- 16 -
W25P022A
Symbol
Dimension in inches
Min. Nom. Max.
Dimension in mm
Min. Nom. Max.
A
A1
0.01 0.014 0.018 0.25 0.35 0.45
A2
0.101 0.107 0.113 2.57 2.72 2.87
b
0.008 0.012 0.016 0.20 0.30 0.40
c
0.004 0.006 0.008 0.10 0.15 0.20
D
0.547 0.551 0.555 13.90 14.00 14.10
E
0.783 0.787 0.791 19.90 20.00 20.10
e
0.020 0.026 0.032 0.498 0.65 0.802
HD ^{0.669 0.677 0.685 17.00 17.20 17.40}
H E ^{0.905 0.913 0.921 23.00 23.20 23.40}
L
0.025 0.031 0.037 0.65 0.80 0.95
L1
0.063
1.60
y
0.003
0.08
θ
0
7
0
7
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
on final visual inspection spec.
Symbol
Dimension in inches
Min. Nom. Max.
Dimension in mm
Min. Nom. Max.
A
A1
0.002 0.004 0.006 0.05 0.10 0.15
A 2 ^{0.053 0.055 0.057 1035 1.40 1.45}
b
0.009 0.013 0.015 0.22 0.32 0.38
c
0.004 0.006 0.008 0.10 0.15 0.20
D
0.547 0.551 0.555 13.90 14.00 14.10
E
0.783 0.787 0.791 19.90 20.00 20.10
e
0.020 0.026 0.032 0.498 0.65 0.802
H D ^{0.626 0.630 0.634 15.90 16.00 16.10}
H E ^{0.862 0.866 0.870 21.90 22.00 22.10}
L
0.018 0.024 0.030 0.45 0.60 0.75
L1
0.039
1.00
y
0.003
0.08
θ
0
7
0
7
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
on final visual inspection spec.