W9825G6JH Datasheet, PDF (13/42 Pages) Winbond – 4 M  4 BANKS  16 BITS SDRAM

W9825G6JH
9. ELECTRICAL CHARACTERISTICS
9.1 Absolute Maximum Ratings
PARAMETER
Voltage on any pin relative to VSS
Voltage on VDD/VDDQ supply
relative to VSS
Operating Temperature
(-5/-6/-6L/-75/75L)
Operating Temperature (-6I/-6A)
Storage Temperature
Soldering Temperature (10s)
Power Dissipation
Short Circuit Output Current
SYMBOL
RATING
VIN, VOUT -0.5 ~ VDD + 0.5 ( 4.6V max.)
VDD, VDDQ
-0.5 ~ 4.6
TOPR
TOPR
TSTG
TSOLDER
PD
IOUT
0 ~ 70
-40 ~ 85
-55 ~ 150
260
1
50
UNIT NOTES
V
1
V
1
°C
1
°C
1
°C
1
°C
1
W
1
mA
1
Note 1: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and
reliability of the device.
9.2 Recommended DC Operating Conditions
(TA = 0 to 70°C for -5/-6/-6L/-75/75L, TA = -40 to 85°C for -6I/-6A)
PARAMETER
SYMBOL MIN.
Supply Voltage
VDD
3.0
Supply Voltage (for I/O Buffer)
VDDQ
3.0
Input High Voltage
VIH
2.0
Input Low Voltage
VIL
-0.3
Note 2: VIH(max) = VDD/VDDQ+1.5V for pulse width < 5 nS
VIL(min) = VSS/VSSQ-1.5V for pulse width < 5 nS
TYP.
3.3
3.3
-
-
MAX.
3.6
3.6
VDD + 0.3
0.8
UNIT
V
V
V
V
NOTES
2
2
2
2
9.3 Capacitance
(VDD = 3.3V  0.3V, f = 1 MHz, TA = 25°C)
PARAMETER
Input Capacitance
(A0 to A12, BS0, BS1, CS , RAS , CAS , WE , LDQM,
UDQM, CKE)
Input Capacitance (CLK)
Input/Output Capacitance
Note: These parameters are periodically sampled and not 100% tested.
SYMBOL
CI
CCLK
CIO
MIN.
-
-
-
MAX.
3.8
3.5
6.5
UNIT
pf
pf
pf
- 13 -
Publication Release Date: Nov. 29, 2011
Revision A04