W83193R-02 Datasheet, PDF (10/18 Pages) Winbond – 83.3 MHZ 3-DIMM CLOCK

Preliminary W83193R-02/-04/-04A
9.0 SPECIFICATIONS
9.1 Absolute Maximum Ratings
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused inputs
must always be tied to an appropriate logic voltage level (Ground or VDD).
PARAMETER
SYMBOL
RATING
Voltage on any pin with respect to GND
VDD , VIN
-0.5V to +7.0V
Storage Temperature
TSTG
-65° C to +150° C
Ambient Temperature
TB
-55° C to +125° C
Operating Temperature
TA
0° C to +70° C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.
9.2 AC CHARACTERISTICS
VDD = VDDq3 = 3.3V ±5%, VDDq2 = VDDq2b = 2.375V~2.9V , TA = 0° C to +70° C
PARAMETER
SYM. MIN. TYP. MAX. UNITS
Output Duty Cycle
45 50
55
%
CPU/SDRAM to PCI
Offset
t_OFF
1
4
nS
Skew (CPU-CPU), (PCI- _tSKEW
PCI), (SDRAM-SDRAM)
250
pS
CPU/SDRAM
t_CCJ
Cycle to Cycle Jitter
±250 pS
CPU/SDRAM
t_JA
Absolute Jitter
500
pS
Jitter Spectrum 20 dB
BWJ
500 KHz
Bandwidth from Center
Output Rise (0.4V−2.0V)
& Fall (2.0V−0.4V) Time
t_TLH ^0.4
t_THL
1.6
nS
Overshoot/Undershoot
Vover 0.7
1.5
V
Beyond Power Rails
Ring Back Exclusion
VRBE 0.7
2.1
V
TEST CONDITIONS
Measured at 1.5V
15 pF Load Measured at
1.5V
15 pF Load Measured at
1.5V
15 pF Load on CPU and
PCI outputs
22 Ω at source of 8 inch
PCB run to 15 pF load
Ring Back must not enter
this range.
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