W332M72V-XSBX Datasheet, PDF (9/15 Pages) White Electronic Designs Corporation – 32Mx72 Synchronous DRAM

White Electronic Designs
W332M72V-XSBX
specified for the clock pin) prior to CKE going back
HIGH. Once CKE is HIGH, the SDRAM must have NOP
commands issued (a minimum of two clocks) for tXSR,
because time is required for the completion of any internal
refresh in progress.
Upon exiting the self refresh mode, AUTO REFRESH
commands must be issued as both SELF REFRESH and
AUTO REFRESH utilize the row refresh counter.
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on VCC, VCCQ Supply relative to Vss
Voltage on NC or I/O pins relative to Vss
Operating Temperature TA (Mil)
Operating Temperature TA (Ind)
Storage Temperature, Plastic
Unit
-1 to 4.6
V
-1 to 4.6
V
-55 to +125
°C
-40 to +85
°C
-55 to +125
°C
NOTE:
Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CAPACITANCE (NOTE 2)
Parameter
Input Capacitance: CLK
Addresses, BA0-1 Input Capacitance
Input Capacitance: All other input-only pins
Input/Output Capacitance: I/Os
Symbol
Max
Unit
CI1
7
pF
CA
24
pF
CI2
9
pF
CIO
9
pF
BGA THERMAL RESISTANCE
Description
Junction to Ambient (No Airflow)
Junction to Ball
Junction to Case (Top)
Symbol
Typical
Unit
Theta JA
17.0
C/W
Theta JB
16.6
C/W
Theta JC
7.4
C/W
NOTE:
Refer to Application Note “PBGA Thermal Resistance Correlation” at www.wedc.com in the
application notes section for modeling conditions.
Notes
1
1
1
Ju;y 2006
Rev. 3
9
White Electronic Designs Corporation • [phone] • www.wedc.com