W3E32M72S-XSBX Datasheet, PDF (19/19 Pages) White Electronic Designs Corporation – 32Mx72 DDR SDRAM

White Electronic Designs
W3E32M72S-XSBX
Document Title
32M x 72 DDR SDRAM 208 PBGA Multi-Chip Package
Revision History
Rev # History
Rev 0
Rev 1
Initial Release
Changes (Pg. 1, 11, 19)
1.1 Change status to Preliminary
1.2 PCN# 05001
1.3 PCN# 05003
1.4 Add thermal resistance values
1.5 Change max storage temperature to 125°C
Rev 2
Change (Pg 1, 10, 19)
2.1 Add Maximum Junction Temperature spec
Rev 3
Change (Pg. 1, 18, 19)
3.1 Change status to Final
Rev 4
Change (Pg.1, 17, 19)
4.1 Change incorrect package drawing dimension.
Rev 5
Rev 6
Change (Pg. All)
5.1 Add 333Mbs option
Changes (Pg. 1, 10, 11, 17, 19)
6.1 Update typical thermal resistance table
6.2 Add lead solder statement
Release Date Status
March 2004
May 2005
Advanced
Preliminary
May 2005
August 2005
Preliminary
Final
September 2005 Final
March 2006
July 2006
Final
Final
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
July 2006
Rev. 6
19
White Electronic Designs Corporation • [phone] • www.wedc.com