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W3E32M72S-XSBX Datasheet, PDF (17/19 Pages) White Electronic Designs Corporation – 32Mx72 DDR SDRAM | |||
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White Electronic Designs
W3E32M72S-XSBX
PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA)
208 x à 0.51 (0.020) NOM
BOTTOM VIEW
11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1.0 (0.039)NOM
10.0 (0.394) NOM
16.15 (0.636) MAX
0.5 (0.020)
2.56 (0.101) MAX
Note: This package utilizes solder balls which contain lead, Sn 63Pb37; if you require a lead-free solder ball package, please contact WEDC for information.
All linear dimensions are millimeters and parenthetically in inches
White Electronic Designs Corp. reserves the right to change products or speciï¬cations without notice.
July 2006
Rev. 6
17
White Electronic Designs Corporation ⢠(602) 437-1520 ⢠www.wedc.com
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