W3E16M64S-XBX Datasheet, PDF (16/16 Pages) White Electronic Designs Corporation – 16Mx64 DDR SDRAM

White Electronic Designs
Document Title
16M x 64 DDR SDRAM Multi-Chip Package
Revision History
Rev # History
Rev 0 Initial Release
Rev 1
Changes (Pg. 1, 15, 16)
Package dimension changes
1.1 Ball diameter to 0.76 +/-0.08
1.2 Package size to 25x21mm Max
1.3 Package height to 2.65mm Max
1.4 Add solder ball coplanarity of 0.2mm
Rev 2
Changes (Pg. 1, 15, 16)
2.1 Change mechanical drawing to new style
2.2 Change status to preliminary
Rev 3
Changes (Pg. 1, 10, 11, 12, 13, 15, 16)
3.1 Change status to Final
3.2 Correct typographical errors
Rev 4
Changes (Pg. 1, 11, 16)
4.1 Changes IOH, IOL to 12mA minimum
4.2 Update ICC Specifications table values
W3E16M64S-XBX
Release Date Status
December 2002 Advanced
May 2003
Advanced
November 2003 Prelimi-
nary
September 2004 Final
February 2005
Final
February 2005
Rev. 4
16
White Electronic Designs Corporation • [phone] • www.wedc.com