W3E16M64S-XBX Datasheet, PDF (10/16 Pages) White Electronic Designs Corporation – 16Mx64 DDR SDRAM

White Electronic Designs
W3E16M64S-XBX
ABSOLUTE MAXIMUM RATINGS
Parameter
Unit
Voltage on VCC, VCCQ Supply relative to Vss
Voltage on I/O pins relative to VSS
-1 to 3.6
V
-1 to 3.6
V
Operating Temperature TA (Mil)
Operating Temperature TA (Ind)
Storage Temperature, Plastic
-55 to +125 °C
-40 to +85 °C
-55 to +150 °C
NOTE:
Stress greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions greater than those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
CAPACITANCE (NOTE 13)
Parameter
Symbol Max Unit
Input Capacitance: CLK
CI1
8
pF
Addresses, BA0-1 Input Capacitance
CA 30 pF
Input Capacitance: All other input-only pins CI2
8
pF
Input/Output Capacitance: I/Os
CIO 12 pF
BGA THERMAL RESISTANCE
Description
Symbol Max Units Notes
Junction to Ambient (No Airflow) Theta JA 14.5 °C/W 1
Junction to Ball
Theta JB 10.0 °C/W 1
Junction to Case (Top)
Theta JC 5.4 °C/W 1
NOTE 1:
Refer to PBGA Thermal Resistance Correlation application note at www.wedc.com in the
application notes section for modeling conditions.
February 2005
Rev. 4
10
White Electronic Designs Corporation • [phone] • www.wedc.com