W3E64M72S-XBX Datasheet, PDF (11/19 Pages) White Electronic Designs Corporation – 64Mx72 DDR SDRAM

White Electronic Designs
W3E64M72S-XBX
ADVANCED
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on VCC, VCCQ Supply relative to Vss
Voltage on I/O pins relative to Vss
Operating Temperature TA (Mil)
Operating Temperature TA (Ind)
Operating Temperature TA (Com)
Storage Temperature, Plastic
Maximum Junction Temperature
Unit
-1 to 3.6
V
-0.5V to VCCQ +0.5V
V
-55 to +125
°C
-40 to +85
°C
-0 to +70
°C
-55 to +125
°C
125
°C
NOTE: Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
CAPACITANCE (NOTE 13)
Parameter
Input Capacitance: CK/CK#
Addresses, BA0-1 Input Capacitance
Input Capacitance: All other input-only pins
Input/Output Capacitance: I/Os
Symbol
Max
Unit
CI1
TBD
pF
CA
TBD
pF
CI2
TBD
pF
CIO
TBD
pF
BGA THERMAL RESISTANCE
Description
Junction to Ambient (No Airflow)
Junction to Ball
Junction to Case (Top)
Symbol
Max
Theta JA
TBD
Theta JB
TBD
Theta JC
TBD
Units
°C/W
°C/W
°C/W
Refer to "PBGA Thermal Resistance Correlation" (Application Note) at www.wedc.com in the application notes section for modeling conditions.
Notes
1
1
1
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
June 2005
Rev. 0
11
White Electronic Designs Corporation • [phone] • www.wedc.com