593D Datasheet, PDF (9/11 Pages) Vishay Siliconix – Solid Tantalum Chip Capacitors Tantamount Commercial, Surface Mount for Switch Mode Power Supplies and Converters

593D
Vishay Sprague
GUIDE TO APPLICATION
1. A-C Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
I_rms =
P
R_ESR
where,
P = Power Dissipation in Watts @ + 25°C as given
in the table in Paragraph Number 5 (Power
Dissipation).
R_ESR = The capacitor Equivalent Series Resistance
at the specified frequency.
2. A-C Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
V_rms = Z
P
R_ESR
or, from the formula:
V_rms = I_rms x Z
where,
P = Power Dissipation in Watts @ + 25°C as
given in the table in Paragraph Number 5
(Power Dissipation).
R_ESR = The capacitor Equivalent Series Resistance
at the specified frequency.
Z = The capacitor impedance at the specified
frequency.
2.1 The sum of the peak AC voltage plus the DC voltage
shall not exceed the DC voltage rating of the
capacitor.
2.2 The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10% of the DC rating at + 25°C.
3. Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10% of the DC rating at + 25°C, 5% of the
DC rating at + 85°C and 1% of the DC rating at +125°C.
4. Temperature Derating: If these capacitors are to be
operated at temperatures above + 25°C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
Temperature
Derating Factor
+ 25°C
1.0
+ 85°C
0.9
+ 125°C
0.4
5. Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those shown.
It is important that the equivalent Irms value be established
when calculating permissible operating levels. (Power
Dissipation calculated using + 25°C temperature rise.)
Case Code
A
B
C
D
E
Maximum Permissible
Power Dissipation
@ + 25°C (Watts) in free air
0.075
0.085
0.110
0.150
0.165
6. Printed Circuit Board Materials: Type 593D
capacitors are compatible with commonly used printed
circuit board materials (alumina substrates, FR4,
FR5, G10, PTFE-fluorocarbon and porcelanized
steel).
7. Attachment:
7.1 Solder Paste: The recommended thickness of the
solder paste after application is .007" ± .001"
[.178mm ± .025mm]. Care should be exercised in
selecting the solder paste. The metal purity should
be as high as practical. The flux (in the paste) must
be active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat. In
practice this can be aided by extending the solder
preheat time at temperatures below the liquidous state
of the solder.
7.2 Soldering: Capacitors can be attached by
conventional soldering techniques - vapor phase,
infrared reflow, wave soldering and hot plate methods.
The Soldering Profile chart shows maximum
recomended time/temperature conditions for solder-
ing. Attachment with a soldering iron is not recom-
mended due to the difficulty of controlling temperature
and time at temperature.
8. Cleaning (Flux Removal) After Soldering: The
593D is compatible with all commonly used solvents
such as TES, TMS, Prelete, Chlorethane, Terpene
and aqueous cleaning media. However, CFC/ODS
products are not used in the production of these
devices and are not recommended. Solvents contain-
ing methylene chloride or other epoxy solvents should
be avoided since these will attack the epoxy
encapsulation material.
8.1 When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence of
the termination. DO NOT EXCEED 9W/l @ 40kHz
for 2 minutes.
Document Number 40005
Revision 01-Mar-04
For technical questions, contact [e-mail]
www.vishay.com
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