593D Datasheet, PDF (10/11 Pages) Vishay Siliconix – Solid Tantalum Chip Capacitors Tantamount Commercial, Surface Mount for Switch Mode Power Supplies and Converters

593D
Vishay Sprague
GUIDE TO APPLICATION (Continued)
SOLDERING PROFILE
Recommended Solder Profile — Wave Solder
5 - 10 Sec.
300 Max. Recommended
300
260°C
250
250
200
200
150
130°C
150
100
100
50
0
0
50
0
50
100
150
200
250
Time (Seconds)
Recommended Solder Profile — Reflow
300
250
245°C Typical
200
150
130°C Typical
100
50
0
0
50
100
150
Time (Seconds)
300
250
200
150
100
50
0
200
250
9. Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder
connections. These dimensions are highly process sensitive and should be designed to minimize component rework
due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for
both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board
design.
RECOMMENDED MOUNTING PAD GEOMETRIES Iin inches [millimeters]
Wave Solder Pads
D
B
C
E
Reflow Solder Pads
D
B
C
A
E
A
Case
Code
A
B
C
D
E
A
(Min.)
0.034
[0.87]
0.061
[1.54].
061
[1.54]
0.066
[1.68]
0.066
[1.68]
Pad Dimensions
B
(Nom.)
C
(Nom.)
0.085
[2.15]
0.053
[1.35]
0.085
[2.15]
0.065
[1.65]
0.106
[2.70]
0.124
[3.15]
0.106
[2.70]
0.175
[4.45]
0.106
[2.70]
0.175
[4.45]
D
(Nom.)
0.222
[5.65]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
E
(Nom.)
0.048
[1.23]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
Case
Code
A
B
C
D
E
A
(Min.)
0.071
[1.80]
0.110
[2.80]
0.110
[2.80]
0.118
[3.00]
0.118
[3.00]
Pad Dimensions
B
(Nom.)
C
(Nom.)
0.085
[2.15]
0.053
[1.35]
0.085
[2.15]
0.065
[1.65]
0.106
[2.70]
0.124
[3.15]
0.106
[2.70]
0.175
[4.45]
0.106
[2.70]
0.175
[4.45]
D
(Nom.)
0.222
[5.65]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
E
(Nom.)
0.048
[1.23]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
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36
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Document Number 40005
Revision 01-Mar-04