594D Datasheet, PDF (8/9 Pages) Vishay Siliconix – Solid Tantalum Chip Capacitors TANTAMOUNT, Conformal Coated, Maximum CV, Low ESR

9.0 Recommended Mounting Pad Geometries: The nib
must have sufficient clearance to avoid electrical
contact with other components. The width dimension
indicated is the same as the maximum width of the
capacitor. This is to minimize lateral movement.
10.0 Cleaning (Flux Removal) After Soldering: The
594D is compatible with all commonly used solvents
such as TES, TMS, Prelete, Chlorethane, Terpene and
aqueous cleaning media. However, CFC/ODS
products are not used in the production of these
devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack
the epoxy encapsulation material.
594D
Vishay Sprague
REFLOW SOLDER PADS* in inches [millimeters]
B
C
B
A
* Pads for B, C and D case codes are otherwise pad compatible with
Type 293D, B, C and D case codes respectively.
CASE
CODE
B
C
D
R
WIDTH
(A)
0.120
[3.0]
0.136
[3.5]
0.180
[4.6]
0.245
[6.3]
PAD
METALLIZATION SEPARATION
(B)
(C)
0.065
0.065
[1.7
[1.7]
0.090
0.120
[2.3]
[3.1]
0.090
0.145
[2.3]
[3.7]
0.090
0.145
[2.3]
[3.7]
TAPE AND REEL PACKAGING in inches [millimeters]
Top
Cover
Tape
Thickness
Standard orientation is with
the cathode (-) nearest to the
sprocket holes per EIA-481-1
and IEC 286-3.
Case Code
B
C
D
R
Tape Width
12mm
12mm
12mm
12mm
Carrier
Embossment
Component Pitch
4mm
8mm
8mm
8mm
R
Min.
Bending Radius
(Note 2)
Units Per Reel
7" [178] Reel
13" [330] Reel
2000
500
500
600
8000
3000
2500
—
Document Number 40006
Revision 09-Mar-05
For technical questions, contact [e-mail]
www.vishay.com
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