594D Datasheet, PDF (7/9 Pages) Vishay Siliconix – Solid Tantalum Chip Capacitors TANTAMOUNT, Conformal Coated, Maximum CV, Low ESR

594D
Vishay Sprague
GUIDE TO APPLICATION (Continued)
3.2 The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10% of the DC working voltage at + 25°C.
4.0 Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10% of the DC rating at + 25°C and 5% of the
DC rating at + 85°C.
5.0 Temperature Derating: If these capacitors are to be
operated at temperatures above + 25°C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
Temperature
+ 25°C
+ 85°C
+ 125°C
Derating
Factor
1.0
0.9
0.4
6.0 Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be
established when calculating permissible operating
levels. (Power dissipation calculated using + 25°C
temperature rise.)
Case
Code
B
C
D
R
Maximum Permissible
Power Dissipation
@ + 25°C (Watts)
in free air
0.085
0.110
0.150
0.250
7.0 Printed Circuit Board Material: The capacitors are
compatible with most commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel). If your
desired board material is not shown there, please
contact the Tantalum Marketing Department for
assistance in determining compatibility.
8. Attachment:
8.1 Solder Paste: The recommended thickness of the
solder paste after applications is .007" ± .001"
[1.78mm ± .025mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
8.2 Soldering: Capacitors can be attached by
conventional soldering techniques, vapor phase,
convection, infrared reflow wave soldering and hot
plate methods. The Soldering Profile charts show typical
recomended time/temperature conditions for soldering.
Preheating is recommended. The recommended
maximum ramp rate is 2°C per second. Attachment with
a soldering iron is not recommended due to the difficulty
of controlling temperature and time at temperature. The
soldering iron must never come in contact with the
capacitor.
RECOMMENDED REFLOW SOLDERING PROFILE
Recommended Pb Free Reflow Soldering Profile
245°C
10 sec
200°C
217°C
150°C
60 sec
60 - 150 sec
Preheat
25°C
TIME (seconds)
Large Case Codes: D, R
Recommended Pb Free Reflow Soldering Profile
260°C
10 sec
200°C
217°C
150°C
60 sec
60 - 150 sec
Preheat
25°C
TIME (seconds)
Large Case Codes: B, C
Recommended SnPb Reflow Soldering Profile
225°C
10 sec
150°C
183°C
100°C
60 sec
60 - 90 sec
Preheat
25°C
TIME (seconds)
All Case Codes
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Document Number 40006
Revision 09-Mar-05