PR01_15 Datasheet, PDF (6/20 Pages) Vishay Siliconix – Power Metal Film Leaded Resistors

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80
ΔT
(K)
60
40
15 mm
20 mm
25 mm
20
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
Ø 0.78 mm FeCu-leads
P (W)
Minimum distance from resistor body to PCB = 1 mm
PR02 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
PR01, PR02, PR03
Vishay BCcomponents
100
∆T
(K)
80
60
40
15 mm
20 mm
25 mm
20
0
0
1
2 _{P (W)} 3
Ø 0.78 mm Cu-leads
Minimum distance from resistor body to PCB = 1 mm
PR03 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
80
ΔT
(K)
60
40
20
10 mm
15 mm
20 mm
25 mm
0
0
1
Ø 0.58 mm FeCu-leads
2 _{P (W)} 3
Minimum distance from resistor body to PCB = 1 mm
PR03 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
80
ΔT
(K)
60
40
15 mm
20 mm
20
0
0
0.8
1.6
2.4 _{P (W)} 3.2
Ø 0.78 mm FeCu-leads
Minimum distance from resistor body to PCB = 1 mm
PR03 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
Revision: 10-Sep-15
6
Document Number: 28729
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