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PR01_15 Datasheet, PDF (15/20 Pages) Vishay Siliconix – Power Metal Film Leaded Resistors
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TESTS PROCEDURES AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
• IEC 60115-1, generic specification (includes tests)
The test and requirements table contains only the most
important tests. For the full test schedule refer to the
documents listed above.
The tests are carried out in accordance with IEC 60068-2-xx
test method and under standard atmospheric conditions in
accordance with IEC 60068-1, 5.3.
Climatic category LCT / UCT / 56 (rated temperature range:
lower category temperature, upper category temperature;
damp heat, steady state, test duration: 56 days) is valid.
PR01, PR02, PR03
Vishay BCcomponents
Unless otherwise specified the following values apply:
• Temperature: 15 °C to 35 °C
• Relative humidity: 45 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
For performing some of the tests, the components are
mounted on a test board in accordance with IEC 60115-1,
4.31.
In test procedures and requirements table, only the tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods.
A short description of the test procedure is also given.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2-
TEST
METHOD
TEST
PROCEDURE
4.4.1
-
Visual examination
4.4.2
-
Dimensions (outline)
Gauge (mm)
4.5
4.6.1.1
4.7
4.8
4.16
-
Resistance
-
Insulation resistance
-
-
21 (Ua1)
21 (Ub)
21 (Uc)
Voltage proof
Temperature
coefficient
Robustness of
terminations
4.17
20 (Ta)
Solderability
4.18.2
20 (Tb)
Resistance to
soldering heat
Maximum voltage (DC) after 1 min;
metal block method
URMS = Uins; 60 s
At (20 / -55 / 20) °C
and (20 / 155 / 20) °C
Tensile, bending, and torsion
+235 °C; 2 s;
solder bath method; SnPb40
+245 °C; 3 s;
solder bath method; SnAg3Cu0.5
Unmounted components
(260 ± 5) °C; (10 ± 1) s
4.19
14 (Na)
Rapid change of
temperature
30 min at -55 °C and
30 min at +200 °C; 5 cycles
4.20
29 (Eb)
4.22
6 (Fc)
Bump
Vibration
3 x 1500 bumps in three directions; 40 g
10 sweep cycles per direction;
10 Hz to 2000 Hz;
1.5 mm or 200 m/s2
REQUIREMENTS PERMISSIBLE
CHANGE
(Rmax.)
No holes; clean surface; no damage
See Straight and Kinked Dimensions
tables
±5%R
Rins min.: 104 M
No breakdown or flashover
 ± 250 ppm/K
No damage
Rmax.: ± (0.5 % R + 0.05 )
Good tinning
( 95 % covered, no visible damage)
Good tinning
( 95 % covered, no visible damage)
Rmax.: ± (1 % R + 0.05 )
No visual damage
PR01: Rmax.: ± (1 % R + 0.05 )
PR02: Rmax.: ± (1 % R + 0.05 )
PR03: Rmax.: ± (2 % R + 0.05 )
No damage
Rmax.: ± (0.5 % R + 0.05 )
No damage
Rmax.: ± (0.5 % R + 0.05 )
Revision: 10-Sep-15
15
Document Number: 28729
For technical questions, contact: filmresistorsleaded@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000