PR01_15 Datasheet, PDF (5/20 Pages) Vishay Siliconix – Power Metal Film Leaded Resistors

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FUNCTIONAL PERFORMANCE
The power that the resistor can dissipate depends on the operating temperature.
100
PR01, PR02, PR03
Vishay BCcomponents
80
60
40
20
0
-55
Derating
0
50 ₇₀
100
150
200
Ambient Temperature in °C
Maximum dissipation (P_max.) in percentage of rated power as a function of the ambient temperature (T_amb)
50
ΔT
(K)
40
30
20
15 mm
20 mm
25 mm
50
ΔT
(K)
40
30
20
15 mm
20 mm
25 mm
10
10
0
0
0.4
0.8 _{P (W)} 1.2
Ø 0.58 mm Cu-leads
Minimum distance from resistor body to PCB = 1 mm
PR01 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
70
ΔT
(K)
60
15 mm
50
20 mm
40
30
25 mm
20
10
0
0
Ø 0.58 mm FeCu-leads
1
P (W)
2
Minimum distance from resistor body to PCB = 1 mm
PR02 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
0
0
0.4
Ø 0.58 mm FeCu-leads
0.8 _{P (W)} 1.2
Minimum distance from resistor body to PCB = 1 mm
PR01 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
100
∆T
(K)
80
15 mm
60
20 mm
40
25 mm
20
0
0
1
P (W)
2
Ø 0.78 mm Cu-leads
Minimum distance from resistor body to PCB = 1 mm
PR02 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
Revision: 10-Sep-15
5
Document Number: 28729
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