VS-VSK170PBF Datasheet, PDF (3/13 Pages) Vishay Siliconix – SCR/SCR and SCR/Diode

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VS-VSK.170PbF, VS-VSK.250PbF Series
Vishay Semiconductors
SWITCHING
PARAMETER
Typical delay time
Typical rise time
Typical turn-off time
SYMBOL
t_d
t_r
t_q
TEST CONDITIONS
T_J = 25 °C, gate current = 1 A dI_g/dt = 1 A/μs
V_d = 0.67 % V_DRM
I_TM = 300 A; dI/dt = 15 A/μs; T_J = T_J maximum;
V_R = 50 V; dV/dt = 20 V/μs; gate 0 V, 100 Ω
VSK.170 VSK.250 UNITS
1.0
2.0
μs
50 to 150
BLOCKING
PARAMETER
Maximum peak reverse and
off-state leakage current
RMS insulation voltage
Critical rate of rise of off-state voltage
SYMBOL
I_RRM,
I_DRM
V_INS
dV/dt
TEST CONDITIONS
VSK.170 VSK.250
T_J = T_J maximum
50
60
50 Hz, circuit to base, all terminals shorted, 25 °C, 1 s
T_J = T_J maximum, exponential to 67 % rated V_DRM
3000
1000
UNITS
mA
V
V/μs
TRIGGERING
PARAMETER
Maximum peak gate power
Maximum average gate power
Maximum peak gate current
Maximum peak negative gate voltage
SYMBOL
P_GM
P_G(AV)
+ I_GM
- V_GT
Maximum required DC gate voltage to trigger V_GT
Maximum required DC gate current to trigger
I_GT
Maximum gate voltage that will not trigger
Maximum gate current that willnot trigger
Maximum rate of rise of turned-on current
V_GD
I_GD
dI/dt
TEST CONDITIONS
VSK.170 VSK.250
t_p ≤ 5 ms, T_J = T_J maximum
10.0
f = 50 Hz, T_J = T_J maximum
2.0
t_p ≤ 5 ms, T_J = T_J maximum
3.0
t_p ≤ 5 ms, T_J = T_J maximum
5.0
T_J = - 40 °C
4.0
Anode supply = 12 V,
T_J = 25 °C
resistive load; Ra = 1 Ω
3.0
T_J = T_J maximum
2.0
T_J = - 40 °C
350
Anode supply = 12 V,
T_J = 25 °C
resistive load; Ra = 1 Ω
200
T_J = T_J maximum
100
T_J = T_J maximum, rated V_DRM applied
0.25
T_J = T_J maximum, rated V_DRM applied
T_J = T_J maximum, I_TM = 400 A,
rated V_DRM applied
10.0
500
UNITS
W
A
V
mA
V
mA
A/μs
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Junction operating and storage
temperature range
T_J, T_Stg
Maximum thermal resistance,
junction to case per junction
R_thJC
DC operation
Typical thermal resistance,
case to heatsink per module
R_thCS
Mounting surface flat, smooth and greased
Mounting torque ± 10 %
MAP to heatsink
busbar to MAP
A mounting compound is recommended
and the torque should be rechecked after
a period of about 3 hours to allow for the
spread of the compound.
Approximate weight
Case style
VSK.170 VSK.250 UNITS
- 40 to 130
°C
0.17
0.125
K/W
0.02
0.02
4 to 6
Nm
500
g
17.8
oz.
MAGN-A-PAK
Revision: 17-Jul-14
3
Document Number: 94417
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