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VS-50MT060WHTAPBF Datasheet, PDF (3/6 Pages) Vishay Siliconix – Half Bridge IGBT MTP (Warp Speed IGBT), 114 A | |||
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VS-50MT060WHTAPbF
Vishay Semiconductors
THERMISTOR SPECIFICATIONS
PARAMETER
SYMBOL
Resistance
Sensitivity index of theï
thermistor material
R0 (1)
ï¢ (1)(2)
Notes
(1) T0, T1 are thermistor´s temperatures
(2)
R-----0-
R1
=
exp
ï¢
ï¦
ï¨
--1---
T0
â
T--1--1- ï¸ï¶
, temperature in Kelvin
T0 = 25 °C
T0 = 25 °Cï
T1 = 85 °C
TEST CONDITIONS
MIN.
-
TYP.
30
MAX. UNITS
-
kï
-
4000
-
K
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
MIN. TYP. MAX. UNITS
Operating junction ï IGBT, Diode
temperature range
Thermistor
TJ
-40
-
150
-40
-
125
°C
Storage temperature range
Junction to case
IGBT
Diode
TStg
RthJC
-40
-
125
-
-
0.38
-
-
0.8 °C/W
Case to sink per module
Clearance (1)
Creepage (1)
Mounting torque to heatsink
Weight
RthCS Heatsink compound thermal conductivity = 1 W/mK -
0.06
-
External shortest distance in air between 2 terminals 5.5
-
Shortest distance along the external surface of the
insulating material between 2 terminals
8
-
-
mm
-
A mounting compound is recommended and the
torque should be checked after 3 hours to allow for
3 ± 10 %
Nm
the spread of the compound. Lubricated threads.
66
g
Note
(1) Standard version only i.e. without optional thermistor
ï
100
VGE = 15 V
20 μs pulse width
10
TJ = 150 °C
TJ = 25 °C
1
0.1
1.0
10
94468_01
VCE - Collector to Emitter Voltage (V)
Fig. 1 - Typical Output Characteristics
120
100
80
60
40
20
0
25
50
75
100
125
150
94468_02
TC - Case Temperature (°C)
Fig. 2 - Maximum Collector Current vs. Case Temperature
Revision: 10-Jun-15
3
Document Number: 94468
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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