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SUD50N06-36 Datasheet, PDF (2/7 Pages) Vishay Siliconix – N-Channel 60-V (D-S), 150 °C MOSFET
SUD50N06-36
Vishay Siliconix
New Product
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
Static
Drain-Source Breakdown Voltage
VDS
VGS = 0 V, ID = 1 mA
60
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
ΔVDS/TJ
ΔVGS(th)/TJ
ID = 250 µA
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = 250 µA
1.0
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
VDS = 60 V, VGS = 0 V
VDS = 60 V, VGS = 0 V, TJ = 70 °C
ID(on)
VDS ≥ 5 V, VGS = 10 V
30
Drain-Source On-State Resistancea
Forward Transconductancea
Dynamicb
rDS(on)
gfs
VGS = 10 V, ID = 10 A
VGS = 4.5 V, ID = 8 A
VDS = 15 V, ID = 10 A
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Ciss
Coss
Crss
Qg
VDS = 30 V, VGS = 0 V, f = 1 MHz
VDS = 30 V, VGS = 10 V, ID = 5 A
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
td(on)
Rise Time
tr
Turn-Off Delay Time
td(off)
Fall Time
tf
Turn-On Delay Time
td(on)
Rise Time
tr
Turn-Off Delay Time
td(off)
Fall Time
tf
Drain-Source Body Diode Characteristics
VDS = 30 V, VGS = 4.5 V, ID = 5 A
f = 1 MHz
VDD = 30 V, RL = 1 Ω
ID ≅ 30 A, VGEN = 4.5 V, Rg = 1 Ω
VDD = 30 V, RL = 1 Ω
ID ≅ 30 A, VGEN = 10 V, Rg = 1 Ω
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Currenta
ISM
TC = 25 °C
Body Diode Voltage
VSD
IS = 5.5 A
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Qrr
ta
IF = 5.5 A, di/dt = 100 A/µs, TJ = 25 °C
Reverse Recovery Rise Time
tb
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Typ
55
- 6.3
0.028
0.033
20
1100
90
55
21
10.5
3.5
4.2
3.3
18
250
35
68
6
9
19
7
0.85
25
25
19
6
Max
3.0
± 100
1
20
0.036
0.042
32
16
6.5
30
400
55
110
12
18
30
14
20
50
1.2
50
50
Unit
V
mV/°C
V
nA
µA
A
Ω
S
pF
nC
Ω
ns
A
V
ns
nC
ns
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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2
Document Number: 70437
S-72510-Rev. A, 03-Dec-07