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SI4812BDY-E3 Datasheet, PDF (2/9 Pages) Vishay Siliconix – N-Channel 30-V (D-S) MOSFET with Schottky Diode
Si4812BDY
Vishay Siliconix
MOSFET AND SCHOTTKY SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
(MOSFET and Schottky)
On-State Drain Currenta
VGS(th)
IGSS
IDSS
ID(on)
VDS = VGS, ID = 250 µA
VDS = 0 V, VGS = ± 20 V
VDS = 30 V, VGS = 0 V
VDS = 30 V, VGS = 0 V, TJ = 100 °C
VDS = 30 V, VGS = 0 V, TJ = 125 °C
VDS ≥ 5 V, VGS = 10 V
1
3
V
± 100
nA
0.004 0.100
0.7
10
mA
3.0
20
20
A
Drain-Source On-State Resistancea
Forward Transconductancea
Schottky Diode Forward Voltagea
Dynamicb
RDS(on)
gfs
VSD
VGS = 10 V, ID = 9.5 A
VGS = 4.5 V, ID = 7.7 A
VDS = 15 V, ID = 9.5 A
IS = 1.0 A, VGS = 0 V
IS = 1.0 A, VGS = 0 V, TJ = 125 °C
0.013 0.016
Ω
0.0165 0.021
45
S
0.45
0.50
V
0.33
0.42
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
Qg
Qgs
Qgd
Rg
td(on)
tr
td(off)
tf
trr
VDS = 15 V, VGS = 5 V, ID = 9.5 A
VDD = 15 V, RL = 15 Ω
ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω
IF = 1.0 A, dI/dt = 100 A/µs
8.5
13
3
nC
2.6
0.3
0.7
1.1
Ω
15
25
13
20
20
30
ns
8
15
22
35
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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2
Document Number: 73038
S-83039-Rev. D, 29-Dec-08