SI4724 Datasheet, PDF (2/11 Pages) Vishay Siliconix – N-Channel Synchronous MOSFETs With Break-Before-Make

Si4724
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Steady State
Unit
Logic Supply
V_DD
7
Logic Inputs
V_IN
- 0.7 to V_DD + 0.3
Drain Voltage
V_D1
30
V
Bootstrap Voltage
V_BOOT
V_S1 + 7
Synchronous pin Voltage
V_SYNC
- 0.7 to V_DD + 0.3
Continuous Drain Current
T_A = 25 °C
T_A = 70 °C
I_D1
5.1
4.09
A
T_A = 25 °C
T_A = 70 °C
I_D2
6.5
5.2
Maximum Power Dissipation^a
P_D
1.2
W
Driver
- 65 to 125
Operating Junction and Storage Temperature Range
MOSFETs
T_J, T_stg
- 65 to 150
°C
Notes:
a. Surface mounted on 1" x 1" FR4 board, full copper two sides.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Steady State
Unit
Drain Voltage
Logic Supply
Input Logic High Voltage
Input Logic Low Voltage
Bootstrap Capacitor
Ambient Temperature
V_D1
0 to 30
V_DD
4.5 to 5.5
V
V_IH
0.7 x V_DD to V_DD
V_IL
- 0.3 to 0.3 x V_DD
C_BOOT
0.1 to 1
µ
T_A
- 40 to 85
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Highside Junction-to-Ambient^a
R_thJA1
85
105
Lowside Junction-to-Ambient^a
Highside Junction-to-Foot (Drain)^b
R_thJA2
68
Steady State
R_thJF1
28
85
°C/W
35
Lowside Junction-to-Foot (Drain)^b
R_thJF2
19
24
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. Junction-to-foot thermal impedance represents the effective thermal impedance of all heat carrying leads in parallel and is intended for use in
conjunction with the thermal impedance of the PC board pads to ambient (R_thJA = R_thJF + R_thPCB-A). It can also be used to estimate chip tem-
perature if power dissipation and the lead temperature of a heat carrying (drain) lead is known.
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Document Number: 71863
2
S11-1185-Rev. F, 13-Jun-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000