MDP16 Datasheet, PDF (2/4 Pages) Vishay Siliconix – Thick Film Resistor Networks, Dual-In-Line, Molded DIP, 01, 03, 05 Schematics

Thick Film Resistor Networks, DIP, Molded
DIMENSIONS in inches [millimeters]
A ± 0.010 [0.254]
0.120 ± 0.005
[3.05 ± 0.127]
Pin #1
Identification
Pin #1
0.075 ± 0.015
[1.90 ± 0.381]
0.100 ± 0.010
[2.54 ± 0.254]
Non-Accumulative Tol.
"C" Spaces
0.018 ± 0.003
[0.457 ± 0.076]
0.030
[0.762] Typ.
0.130 + 0.015
- 0.010
[3.30 + 0.381
- 0.254]
B ± 0.010 [0.254]
0.050 ± 0.005
[1.27 ± 0.127]
MDP 14, 16
Vishay Dale
0.310 ± 0.010
[7.87 ± 0.254]
0.250 ± 0.005
[6.35 ± 0.127]
0.290 Min.
0.320 Nom.
0.360 Max.
[7.37 Min.
8.13 Nom.
9.14 Max.]
0.010 + 0.005
- 0.002
[0.254 + 0.127
- 0.051]
MODEL
A
B
C
MDP 14
0.750 [19.05]
0.600 [15.24]
6
MDP 16
0.850 [21.59]
0.700 [17.78]
7
TECHNICAL SPECIFICATIONS
PARAMETER
Package Power Rating (Maximum at + 70°C)
Voltage Coefficient of Resistance
Dielectric Strength
Insulation Resistance
Operating Temperature Range
Storage Temperature Range:
UNIT
W
V_eff
VAC
Ω
°C
°C
MDP-14
1.73
< 50ppm typical
200
> 10,000M minimum
- 55 to + 125
- 55 to + 150
MDP-16
1.92
MECHANICAL SPECIFICATIONS
Marking Resistance to Solvents:
Solderability:
Body:
Terminals:
Weight:
Permanency testing per MIL-STD-202, Method 215.
Per MIL-STD-202, Method 208E.
Molded epoxy.
Copper alloy, tin-lead plated.
14 pin = 1.3 grams; 16 pin = 1.5 grams
Document Number: 31511
Revision 06-Aug-02
For Technical Questions, contact: [e-mail]
www.vishay.com
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