SIB404DK Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 12 V (D-S) MOSFET

New Product
N-Channel 12 V (D-S) MOSFET
SiB404DK
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
12
R_DS(on) ()
0.019 at V_GS = 4.5 V
0.022 at V_GS = 2.5 V
0.026 at V_GS = 1.8 V
0.065 at V_GS = 1.2 V
I_D (A)^a
9
9
9
3
Q_g (Typ.)
9.6 nC
PowerPAK SC-75-6L-Single
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-75 Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.75 mm Profile
• 100 % R_g Tested
• Compliant to RoHS Directive 2002/95/EC
D
D
6
D
5
1.60 mm ^S
4
1
D
2
D
3
G
S
1.60 mm
APPLICATIONS
• Portable Devices
• Low Voltage Gate Drive Load Switch
Marking Code
G
AIX
Part # code
XXX
Lot Traceability
and Date code
S
Ordering Information: SiB404DK-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
12
V_GS
±5
V
T_C = 25 °C
9^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
9^a
8.9^{b, c}
T_A = 70 °C
7.1^{b, c}
A
Pulsed Drain Current
I_DM
35
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
9^a
2.1^{b, c}
T_C = 25 °C
13
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
8.4
2.5^{b, c}
W
T_A = 70 °C
1.6^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t5s
Steady State
Symbol
R_thJA
R_thJC
Typical
41
7.5
Maximum
51
9.5
Unit
°C/W
Notes:
a. Package limited, T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 67099
S11-0236-Rev. A, 14-Feb-11
www.vishay.com
1