SIA936EDJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – Dual N-Channel 20 V (D-S) MOSFET

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SiA936EDJ
Vishay Siliconix
Dual N-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
20
R_DS(on) () MAX.
0.034 at V_GS = 4.5 V
0.037 at V_GS = 3.7 V
0.045 at V_GS = 2.5 V
I_D (A)
4.5^a
4.5^a
4.5^a
Q_g (TYP.)
5.4 nC
PowerPAK^® SC-70-6L Dual
D₁
G_{2 6}
S_{2 5}
4
D1
D2
1 _2.05 ^mm
Top View
1
2 S₁
3 G₁
D₂
Bottom View
Marking Code: CK
Ordering Information:
SiA936EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• Thermally enhanced PowerPAK^® SC-70 package
- Small footprint area
- Low on-resistance
• Typical ESD protection: 2000 V (HBM)
• 100 % R_g tested
• Material categorization: For definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
• Portable devices such as smart phones, tablet PCs and
mobile computing
- Load switch
- DC/DC converter
- Power management
D₁
D₂
G₁
G₂
N-Channel MOSFET S1 N-Channel MOSFET S₂
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
V_GS
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^d,e
I_DM
I_S
P_D
T_J, T_stg
LIMIT
20
± 12
4.5 ^a
4.5 ^a
4.5 ^a,b,c
4.5 ^a,b,c
20
4.5 ^a
1.6 ^b,c
7.8
5
1.9 ^b,c
1.2 ^b,c
-55 to 150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient ^b,f
Maximum Junction-to-Case (Drain)
t5s
Steady State
SYMBOL
R_thJA
R_thJC
TYPICAL
52
12.5
MAXIMUM
65
16
UNIT
°C/W
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state condition is 110 °C/W.
S13-2624-Rev. A, 23-Dec-13
1
Document Number: 62929
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000