SIA931DJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – Dual P-Channel 30-V (D-S) MOSFET

Dual P-Channel 30-V (D-S) MOSFET
SiA931DJ
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.065 at V_GS = - 10 V
- 30
0.080 at V_GS = - 6 V
0.100 at V_GS = - 4.5 V
I_D (A)
- 4.5^a
- 4.5^a
- 4.5^a
Q_g (Typ.)
4.1 nC
PowerPAK SC-70-6 Dual
1
S1
2
G1
D1
3
D2
D1
6
D2
G2
5
2.05 mm S₂
4
2.05 mm
Marking Code
Part # code
DOX
XXX
Lot Traceability
and Date Code
Ordering Information:
SiA931DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Gen III Power MOSFET
• Thermally Enhanced PowerPAK^®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
• 100 % R_g Tested
• Material categorization: For definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
• Smart Phones, Tablet PCs, Mobile Computing:
- Battery Switches
- Load Switches
- Power Management
- DC/DC Converters
S₁
S₂
G₁
G₂
P-Channel MOSFET
D₁
P-Channel MOSFET
D₂
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 30
V
V_GS
± 20
T_C = 25 °C
- 4.5^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 4.5^a
- 4.3^{b, c}
T_A = 70 °C
- 3.4^{b, c}
A
Pulsed Drain Current (t = 300 µs)
Continuous Source-Drain Diode Current
I_DM
T_C = 25 °C
T_A = 25 °C
I_S
- 28
- 4.5^a
- 1.6^{b, c}
T_C = 25 °C
7.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
5
1.9^{b, c}
W
T_A = 70 °C
1.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t5s
Steady State
R_thJA
R_thJC
52
12.5
65
°C/W
16
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 110 °C/W.
Document Number: 62859
For technical questions, contact: [e-mail]
www.vishay.com
S13-1163-Rev. A, 13-May-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000