SIA445EDJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – P-Channel 20 V (D-S) MOSFET

New Product
P-Channel 20 V (D-S) MOSFET
SiA445EDJ
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω) Max.
0.0165 at V_GS = - 4.5 V
- 20
0.0185 at V_GS = - 3.7 V
0.0300 at V_GS = - 2.5 V
I_D (A)
- 12^a
- 12^a
- 12^a
Q_g (Typ.)
23 nC
PowerPAK SC-70-6L-Single
D
6
D
5
2.05 mm _S
4
1
D
2
D
3
G
S
2.05 mm
Ordering Information:
SiA445EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• Thermally Enhanced PowerPAK^®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
• 100 % R_g Tested
• Built in ESD Protection with Zener Diode
• Typical ESD Performance: 2000 V
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Smart Phones, Tablet PCs, Mobile Computing
- Battery Switch
- Charger Switch
- Load Switch
S
Marking Code
BQX
Part # code
XXX
G
Lot Traceability
and Date code
P-Channel MOSFET _D
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 20
V
V_GS
± 12
T_C = 25 °C
- 12^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 12^a
- 11.8^{b, c}
T_A = 70 °C
- 9.5^{b, c}
A
Pulsed Drain Current (t = 300 µs)
I_DM
- 50
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
- 12^a
- 2.9^{b, c}
T_C = 25 °C
19
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
12
3.5^{b, c}
W
T_A = 70 °C
2.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
28
Steady State
R_thJC
5.3
36
°C/W
6.5
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
Document Number: 63619
www.vishay.com
S11-2525-Rev. A, 26-Dec-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000