SIA400EDJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 30 V (D-S) MOSFET

New Product
N-Channel 30 V (D-S) MOSFET
SiA400EDJ
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) ()
0.019 at V_GS = 4.5 V
30
0.025 at V_GS = 2.5 V
I_D (A)^a
12
12
Q_g (Typ.)
11.6
PowerPAK SC-70-6L-Single
D
6
D
5
2.05 mm
S
4
1
D
2
D
3
G
S
2.05 mm
Ordering Information:
SiA400EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-70 Package
- Small Footprint Area
• Typical ESD Performance 2500 V HBM
• 100 % R_g and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
RoHS
COMPLIANT
APPLICATIONS
• Load Switch, OVP Switch
• Boost Converters
• DC/DC Converters
Marking Code
Part # code
AIX
XXX
Lot Traceability
and Date code
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
± 12
T_C = 25 °C
12^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
12^a
11^{b, c}
Pulsed Drain Current (t = 300 µs)
T_A = 70 °C
I_DM
8.8^{b, c}
30
A
T_C = 25 °C
Continuous Source-Drain Diode Current
T_A = 25 °C
I_S
12^a
2.9^{b, c}
Avalanche Current
Single Pulse Avalanche
L = 0.1 mH
I_AS
E_AS
15
11.25
mJ
T_C = 25 °C
19.2
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
12.3
3.5^{b, c}
W
T_A = 70 °C
2.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
t5s
R_thJA
28
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
5.3
36
°C/W
6.5
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
Document Number: 67844
www.vishay.com
S11-1148-Rev. A, 13-Jun-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000