SI5922DU Datasheet, PDF (1/7 Pages) Vishay Siliconix – Dual N-Channel 30 V (D-S) MOSFET

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Si5922DU
Vishay Siliconix
Dual N-Channel 30 V (D-S) MOSFET
PowerPAK^® ChipFET^® Dual
D₂
D₂
6
D₁
7
D₁
8
5
1 _3.0 ^mm
Top View
1
4
G₂
3
S₂
2
G₁
S₁
Bottom View
FEATURES
• TrenchFET^® power MOSFET
• 100 % R_g and UIS tested
• New thermally enhanced PowerPAK^®
ChipFET^® package
- Small footprint area
- Low on-resistance
- Thin 0.8 mm profile
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) () MAX.
0.0192 at V_GS = 10 V
0.0220 at V_GS = 6 V
0.0245 at V_GS = 4.5 V
I_D (A)
6^a
6^a
6^a
Q_g (TYP.)
4.7 nC
Marking Code: CG
Ordering Information:
Si5922DU-T1-GE3 (lead (Pb)-free and halogen-free)
APPLICATIONS
• DC/DC power supply
D₁
D₂
G₁
N-Channel MOSFET
S₁
G₂
N-Channel MOSFET
S₂
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
Continuous Drain Current (T_J = 150 °C)
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
Pulsed Drain Current (t = 100 μs)
T_A = 70 °C
I_DM
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Avalanche Energy
T_C = 25 °C
T_A = 25 °C
I_S
L = 0.1 mH
I_AS
E_AS
Maximum Power Dissipation
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
P_D
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
T_A = 70 °C
T_J, T_stg
LIMIT
30
+20 / -16
6^a
6^a
6 ^{a, b, c}
6 ^{a, b, c}
24
6^a
1.9 ^{b, c}
10
5
10.4
6.7
2.3 ^{b, c}
1.5 ^{b, c}
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t5s
Steady State
SYMBOL
R_thJA
R_thJC
TYPICAL
43
9.5
MAXIMUM
55
12
UNIT
°C/W
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
S16-1449-Rev. A, 25-Jul-16
1
Document Number: 76056
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000