SI5853DC-T1-E3 Datasheet, PDF (1/9 Pages) Vishay Siliconix – P-Channel 1.8 V (G-S) MOSFET with Schottky Diode

Si5853DC
Vishay Siliconix
P-Channel 1.8 V (G-S) MOSFET with Schottky Diode
MOSFET PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.110 at V_GS = - 4.5 V
- 20
0.160 at V_GS = - 2.5 V
0.240 at V_GS = - 1.8 V
I_D (A)
- 3.6
- 3.0
- 2.4
SCHOTTKY PRODUCT SUMMARY
V_KA (V)
20
V_f (V)
Diode Forward Voltage
0.48 V at 0.5 A
I_F (A)
1.0
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• LITTLE FOOT^® Plus
• Compliant to RoHS Directive 2002/95/EC
1206-8 ChipFET^®
1
A
K
K
A
S
D
G
D
Marking Code
JA XX
Lot Traceability
and Date Code
Part # Code
Bottom View
Ordering Information: Si5853DC-T1-E3 (Lead (Pb)-free)
Si5853DC-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
K
G
D
A
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
5s
Steady State
Unit
Drain-Source Voltage (MOSFET and Schottky)
V_DS
- 20
V
Reverse Voltage (Schottky)
Gate-Source Voltage (MOSFET)
V_KA
20
V
V_GS
±8
±8
Continuous Drain Current (T_J = 150 °C) (MOSFET)^a
T_A = 25 °C
T_A = 85 °C
I_D
- 3.6
- 2.6
- 2.7
- 1.9
Pulsed Drain Current (MOSFET)
Continuous Source Current (MOSFET Diode Conduction)^a
I_DM
- 10
A
I_S
- 1.8
- 0.9
Average Forward Current (Schottky)
I_F
1.0
Pulsed Forward Current (Schottky)
I_FM
7
Maximum Power Dissipation (MOSFET)^a
Maximum Power Dissipation (Schottky)^a
T_A = 25 °C
2.1
T_A = 85 °C
T_A = 25 °C
P_D
1.1
1.3
T_A = 85 °C
0.68
1.1
0.6
W
0.96
0.59
Operating Junction and Storage Temperature Range
T_J, T_stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)^{b, c}
260
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. See reliability manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequate bottom side solder interconnection.
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 71239
S10-0547-Rev. D, 08-Mar-10
www.vishay.com
1