SI5513CDC_10 Datasheet, PDF (1/16 Pages) Vishay Siliconix – N- and P-Channel 20 V (D-S) MOSFET

Si5513CDC
Vishay Siliconix
N- and P-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
N-Channel 20
0.055 at V_GS = 4.5 V
0.085 at V_GS = 2.5 V
0.150 at V_GS = - 4.5 V
P-Channel - 20
0.255 at V_GS = - 2.5 V
I_D (A)^a
4^g
4^g
- 3.7
- 2.9
Q_g (Typ.)
2.6 nC
3.6 nC
1206-8 ChipFET^®
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFETs
• 100 % R_g Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Load Switch for Portable Devices
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D₁
S₂
S₁
D₁
G₁
D₁
S₂
D₂
G₂
D₂
Marking Code
EG XXX
Lot Traceability
and Date Code
Part # Code
Bottom View
Ordering Information: Si5513CDC-T1-E3 (Lead (Pb)-free)
Si5513CDC-T1-GE3 (Lead (Pb)-free and Halogen-free)
G₂
G₁
S₁
N-Channel MOSFET
D₂
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
- 20
V_GS
± 12
V
T_C = 25 °C
4^g
- 3.7
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
4^g
4^{b, c, g}
- 3.0
- 2.4^{b, c}
T_A = 70 °C
3.5^{b, c}
- 1.9^{b, c}
A
Pulsed Drain Current
I_DM
10
-8
Source Drain Current Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
2.6
1.4^{b, c}
- 2.6
- 1.7^{b, c}
T_C = 25 °C
3.1
3.1
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
2.0
1.7^{b, c}
2.0
1.3^{b, c}
W
T_A = 70 °C
1.1^{b, c}
0.8^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Symbol
Typ. Max. Typ. Max.
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Foot (Drain)
t≤5s
Steady State
R_thJA
R_thJF
62
74
77
95
32
40
33
40
°C/W
Notes:
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequade bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 115 °C/W for N-Channel and 130 °C/W for P-Channel.
g. Package limited.
Document Number: 68806
S10-0547-Rev. C, 08-Mar-10
www.vishay.com
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